2 January 2019 – The Global Solder Paste Market is also known as solder cream which is used to fix leads on surface mounted IC chips to the attachment points on the printed circuit boards (PCB), which are usually used in almost all electronic devices. The solder paste is normally applied as a paste with the help of dispensing tubes or stencil on the leads on PCBs, which is followed by heating the paste in order to melt and complete the connection. It is a grey and putty-like material and an exceptionally significant ingredient in the manufacturing of electronic circuit. They are of different compositions subject to their end user requirements. Few of the common solder pastes include tin – silver – copper alloy, tin – antimony alloy, tin – lead alloy, and tin – silver – copper alloy.

Growing demand for electronic manufacturing services is expected to augment the demand for solder paste market over the next eight years. The solder paste market has specially witnessed a bullish run in the last two decades and is anticipated to grow further with the diffusion of information technology and enabled services in human life globally. Solder paste is vital for all semiconductors and printed circuit boards. They find application in nearly all electronic devices including laptops, tablets, medical testing equipment, nuclear detection systems, weather analysis equipment, computers, smart phones, televisions, fiber optic receptors, and data storage devices among many others. PCBs are also used in automotive, aerospace, and marine vehicles industry for electronic functions. Old-fashioned single layer PCBs are progressively evolving into multilayer PCBs with wide functionality. The technological improvement in the printed circuit board market is expected to augment the demand for solder paste over the forecast period.


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The solder paste market is mostly hindered by its substitute products. Though, the demand for lead-free solder paste has been growing owing to environmental concerns of lead. According to estimations, more than 30.0 million tons of electronic wastes are accumulated every year and the lead content in electronic wastes creates havoc on environmental balance. Lead-containing alloys demand is anticipated to decline over the forecast period. However, there are no such significant limitations to the solder paste market as a whole.  Geographically, the solder paste market is segmented into North America, Asia-Pacific, Latin America, Middle East and Africa, and Europe. The global outlook for electronic equipment and its applications holds potential as consumer electronics has witnessed remarkable growth in the recent past and is expected to rise in the foreseeable future. This presents an incredible opportunity for solder paste market particularly in the developing regions of Latin America, Africa, and Asia Pacific.

China accounts for the major demand for solder paste and is the largest manufacturer of electronic devices and ancillary parts globally. The demand for solder paste is anticipated to surge in this region over the forecast period owing to export related electronics manufacturing services. China is the foremost manufacturer of solder paste globally. Asia Pacific accounts for over 50.0% of the global demand, led by China, Korea, India, and Japan. The key players dominating the market for solder paste include Kester, AIM Metals and Alloys, LLC, Ku Ping Enterprise Co., Ltd., Dyfenco Electronic Chemical Corporation, while other significant players include SMT International LLC, Chung I Silver Solder Co., Ltd., Chemco Industry Corporation, and Shenmao Technology Inc., among several others


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Market Segment:

Key Applications

  • SMT Assembly
  • Semiconductor Packaging

Key Regions

  • North America
  • Europe
  • Asia Pacific
  • Middle East and Africa
  • South America