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Advanced Packaging Technologies Market By Technology (Active Packaging, Smart and Intelligent Packaging), End- User (Food, Beverages, Alcoholic Beverages, Non-Alcoholic Beverages, Pharmaceuticals, Industrial & Chemicals, Cosmetics & Personal Care, Agriculture, Others), Type (3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Fan Out Silicon in Package, Fan Out Wafer Lever Package, Wafer Level Chip Scale Package, Flip Chip, Others), Industry Vertical (Consumer Electronics, IT & Telecommunication, Industrial, Automotive & Transport, Healthcare, Aerospace & Defense, Others), Geography (North America, South America, Europe, Asia-Pacific, Middle East and Africa) – Industry Trends and Forecast to 2026

Global advanced packaging technologies market is set to witness a substantial CAGR of 7.67% in the forecast period of 2019- 2026. The report contains data of the base year 2018 and historic year 2017. Increasing R&D investment for product development and technological advancement and development are the factor for the growth of this market.

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Market Definition: Global Advanced Packaging Technologies Market

Advanced packaging is specially designed to improve the device performance by using integrated circuits which protect the metallic part from damaging. 3D integrated circuits, 2.5D integrated circuits, fan out wafer level package and among others are some of the common types of advanced packaging technologies. Different types of integrated circuits are manufactured as per the need of the packaging. They are widely used in industries such as healthcare, automotive, aerospace, defense and others.

Market Drivers:

Rising awareness about its advantages over conventional packaging technologies will drive the market growth

Increasing R&D activities will propel the growth of the market

Rising demand of these packaging from food and beverage industry will also act as a factor driving the market growth

Technological advancement and development in packaging technologies is driving the growth of the market

Market Restraints:

Problem related to the heating in devices will restrain the market growth

Dearth of standardization will also hamper the growth of the market

Global Advanced Packaging Technologies Market Segmentation:

By Technology

  • Active Packaging
  • Active Scavenging Systems
  • Oxygen Scavengers
  • Moisture Scavengers/Absorbers
  • Ethylene Absorbers
  • Active Releasing Systems
  • Carbon Dioxide Emitters
  • Antioxidant Releasers
  • Modified Atmosphere Packaging (MAP)
  • Temperature Control Packaging
  • Anti-Corrosion Films
  • Smart and Intelligent Packaging
  • Time-Temperature Indicators Tags & Labels
  • Freshness Indicators
  • Oxygen and CO2 Indicators
  • RFID
  • Others

By End- User

  • Food
  • Meat, Poultry and Seafood
  • Fruits and Vegetable
  • Ready to Eat Meals
  • Dairy Foods
  • Bakery and Confectionary
  • Frozen Foods
  • Cereals
  • Beverages
  • Alcoholic Beverages
  • Non-Alcoholic Beverages
  • Pharmaceuticals
  • Industrial & Chemicals
  • Cosmetics & Personal Care
  • Agriculture
  • Others

By Type

  • 3D Integrated Circuit
  • 2D Integrated Circuit
  • 5D Integrated Circuit
  • Fan Out Silicon in Package
  • Fan Out Wafer Lever Package
  • Wafer Level Chip Scale Package
  • Flip Chip
  • Others

By Industry Vertical

  • Consumer Electronics
  • IT & Telecommunication
  • Industrial
  • Automotive & Transport
  • Healthcare
  • Aerospace & Defense
  • Others

By Geography

  • North America
  • S.
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Rest of South America
  • Europe
  • Germany
  • United Kingdom
  • Italy
  • France
  • Spain
  • Russia
  • Turkey
  • Belgium
  • Netherlands
  • Switzerland
  • Rest of Europe
  • Asia-Pacific
  • Japan
  • South Korea
  • India
  • Australia
  • Singapore

Get Detailed TOC:

Key Developments in the Market:

In August 2018, Rudolph Technologies, Inc. announced the launch of their new Dragonfly G2 platform which is specially designed to provide more choices for advanced packaging to the customers so that they will be able to get wafer based applications on the single platform. It also has camera technology so that they can increase the productivity. The main aim of the launch is to meet the requirement for high quality products

In July 2017, Kulicke & Soffa Industries, Inc. announced that they have acquired Liteq BV. This acquisition will help the company to strengthen their market position and will also help them to expand their advanced packaging portfolio. The company will use Liteq technologies and services in order to provide advanced packaging services to their customers

Competitive Analysis:

Global advanced packaging technologies market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of advanced packaging technologies market for Global, Europe, North America, Asia-Pacific, South America and Middle East & Africa.

Key Market Competitors:

Few of the major competitors currently working in the global advanced packaging technologies market are ASE Group., Amkor Technology, Siliconware Precision Industries Co., Ltd., STATS ChipPAC Pte. Ltd., SÜSS MICROTEC SE, IBM Corporation, COVERIS, Universal Instruments Corporation, Heidelberg Instruments, McKinsey & Company., Advanced Packaging Technology (M) Bhd, Veeco Instruments Inc., Boschman, CCL Industries., Jawla Advance Technology, ASM Pacific Technology, Orbotech Ltd., Taiwan Semiconductor Manufacturing Company Limited, ams AG, NAURA Akrion Inc., Rudolph Technologies and others

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Research Methodology: Global Advanced Packaging Technologies Market

Data collection and base year analysis is done using data collection modules with large sample sizes. The market data is analysed and forecasted using market statistical and coherent models. Also market share analysis and key trend analysis are the major success factors in the market report. To know more please request an analyst call or can drop down your enquiry.

The key research methodology used by DBMR research team is data triangulation which involves data mining, analysis of the impact of data variables on the market, and primary (industry expert) validation. Apart from this, other data models include Vendor Positioning Grid, Market Time Line Analysis, Market Overview and Guide, Company Positioning Grid, Company Market Share Analysis, Standards of Measurement, Top to Bottom Analysis and Vendor Share Analysis. To know more about the research methodology, drop in an inquiry to speak to our industry experts.

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