Back in May we heard that Honor’s upcoming Magic8 flagship series would consist of a Mini, and today on Weibo a few of this gadget’s specifications have actually been outed.
According to the respected Chinese leaker who passes Digital Chat Station, the Honor Magic8 Mini will be powered by MediaTek’s Dimensity 9500 SoC, which is intriguing because the Magic7 gadgets all chose Snapdragon chipsets.
< img width ="1200" height ="799" alt ="Honor Magic7 Pro" src ="https://fdn.gsmarena.com/imgroot/news/25/08/honor-magic8-mini-specs-leak/inline/-1200w5/gsmarena_001.jpg">
Honor Magic7 Pro
The Magic8 Mini will supposedly boast a 6.3-inch screen, and the phone will be thin and light- really Thin. Since of that, it will not have a substantial battery, however DCS guarantees us that it’s still much bigger than the one in the Apple iPhone 17 Air, and the software application will be enhanced to be really battery-friendly too.
It’s uncertain when the Magic8 Mini will release, however there’s some speculation over on Weibo that it might get here a bit behind the other family members. For referral, note that the Magic7 handsets were revealed in October and launched in early November, however given that both MediaTek and Qualcomm are revealing their next-gen flagship chipsets in late September this year, the timeline might move.
Source (in Chinese)|Via