Rapid changes in the industry of pipe repairs have made way for new technology. Advanced Pipe Repair leads the way, perfecting the process of cured-in-place pipe repairs and UV CIPP technology.
For so many years, the piping and plumbing industry has relied on digging and invasive practices to repair pipelines. While there are times this may still be necessary, the industry is quickly changing. New technology continues to improve the process, and Advanced Pipe Repair has perfected the process of Cured in Place Pipe repairs and UV CIPP technology.
CIPP technology works by inserting a liner through an open access point and then inflating the liner and sealing it to the pipe that needs to be repaired. With UV technology, CIPP seals and dries in record timing, allowing you to get back to business as usual without downtime or digging.
CIPP, or cured-in-place pipe, lining can solve small and big problems, making it a go-to solution to skip the dig and resolve your pipelining issues. The time has come to do away with unnecessary digging when a repair can be made with little to no excavation. These CIPP lining repairs are just as effective and often last much longer than traditional excavation and digging repairs. And they accomplish the task without extensive downtime or invasive practices.
CIPP has come a long way since it was first introduced. The solutions have changed to become more effective without being harmful. The introduction of UV CIPP technology improved the process even more. With UV technology, adhesion occurs quickly and curing takes far less time. Not to mention skipping the dig means no damage to the ground or heavy equipment in the way.
Advanced Pipe Repair has more than 25 years in the commercial pipelining industry. They understand pipe repairs and the steps necessary to make those repairs more effectively. Serving commercial, government, and industrial industries, the company can handle pipe restoration and replacement on a massive scale, providing you with innovative solutions when you need them most.