Samsung’s next-generation flagship chipset, the Exynos 2700, might embrace a brand-new product packaging style, according to a current report. The business is supposedly preparing to move far from Fan-Out Wafer-Level Packaging (FOWLP) innovation for the upcoming SoC.
Fan-Out Wafer-Level Packaging (FOWLP), which Samsung has actually utilized because the Exynos 2400, apparently assisted enhance thermal efficiency. The innovation is stated to have actually been less lucrative for the business due to its complex and expensive production procedure.
< img width ="1200" height ="800" src ="https://fdn.gsmarena.com/imgroot/news/26/05/samsung-exynos-2700-sbs-packaging-tech/inline/-1200/gsmarena_001.jpg" alt ="Samsung's Exynos 2700 SoC for Galaxy S27 series to reportedly ditch WLP technology">
According to the report, which mentions a market authorities, Samsung prepares to embrace a brand-new product packaging architecture for the Exynos 2700 referred to as Side-by-Side (SbS). In this style, the application processor (AP) and DRAM are placed beside each other on the substrate instead of stacked.
The business is likewise anticipated to integrate its Heat Pass Block (HPB) innovation into the Exynos 2700, which might assist enhance heat dissipation and general thermal effectiveness.
Samsung is anticipated to utilize the Exynos 2700 in the Galaxy S27 and Galaxy S27+, both of which are most likely to introduce in early 2027. It will be fascinating to see how the chipset’s brand-new product packaging style will affect thermal efficiency and general performance.
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