Author: dwighthallen

Featuring an aluminum nitride substrate with high 170 W/m°K thermal conductivity, the chip released by New Yorker Electronics is capable of reducing the temperature of connected components by over 25%. This reduction allows designers to increase the power handling capability of these devices or extend their useful life at existing operating conditions while maintaining the electrical isolation of each component. By protecting adjacent devices from thermal loads, overall circuit reliability is improved. The Vishay THJP’s low capacitance down to 0.07 pF makes it an excellent choice for high frequency and thermal ladder applications. The thermal conductor will be used in ... Read more