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According to a new report Global Advanced Packaging Market, published by KBV research, The Global Advanced Packaging Market size is expected to reach $55.8 billion by 2026, rising at a market growth of 12.7% CAGR during the forecast period. One of the driving factors of advanced packaging players is expected to be growing demands for smart as well as power-efficient products from customers and the increasing adoption of IoT by numerous vertical industries.

The Flip-Chip Ball Grid Array market dominated the Global Advanced Packaging Market by Type 2019. The Flip Chip CSP market is exhibiting a CAGR of 12% during (2020 – 2026). Additionally, The Wafer Level CSP market is experiencing a CAGR of 13.5% during (2020 – 2026).

The Consumer Electronics market dominated the Global Advanced Packaging Market by End User 2019, growing at a CAGR of 11.8 % during the forecast period. The Automotive market is poised to grow at a CAGR of 13.2% during (2020 – 2026). The Industrial market is experiencing a CAGR of 14.2% during (2020 – 2026). Additionally, The Aerospace & Defense market is expected to witness CAGR of 15% during (2020 – 2026).

It is expected that Asia-Pacific will grow significantly over the coming years. During the projected period, it was a major revenue-generating region, mainly due to the growing population and customer demand. Major semi-conductor manufacturers present in the region have fueled the need for advanced semi-conductor packaging from a significant amount of time. The Europe market is expected to witness a CAGR of 12.3% during (2020 – 2026). Additionally, The North America market would showcaswe a CAGR of 11.6% during (2020 – 2026).

Structural Insights: https://www.kbvresearch.com/advanced-packaging-market/

The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the globe with country wise analysis in each discussed region. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Qualcomm, Inc., Intel Corporation, IBM Corporation, Texas Instruments, Inc., Analog Devices, Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd. (Samsung Group), Amkor Technology, Inc., Brewer Science, Inc., and MICROCHIP Technology, Inc.

Global Advanced Packaging Market Segmentation

By Type
• Flip-Chip Ball Grid Array
• Flip Chip CSP
• Wafer Level CSP
• 5D/3D
• Others

By End-User
• Consumer Electronics
• Automotive
• Industrial
• Aerospace & Defense
• Healthcare & Life Sciences
• Others

By Geography

North America
• US
• Canada
• Mexico
• Rest of North America

Europe
• Germany
• UK
• France
• Russia
• Spain
• Italy
• Rest of Europe

Asia Pacific
• China
• Japan
• India
• South Korea
• Singapore
• Malaysia
• Rest of Asia Pacific

LAMEA
• Brazil
• Argentina
• UAE
• Saudi Arabia
• South Africa
• Nigeria
• Rest of LAMEA

Companies Profiled
• Qualcomm, Inc.
• Intel Corporation
• IBM Corporation
• Texas Instruments, Inc.
• Analog Devices, Inc.
• Renesas Electronics Corporation
• Samsung Electronics Co., Ltd. (Samsung Group)
• Amkor Technology, Inc.
• Brewer Science, Inc.
• Microchip Technology, Inc.