Global 3D TSV Market-Outlook, Opportunity, Projects, Application and Company Analysis 2018-2024

The latest report on 3D TSV  Market by Infinium Global Research gives complete coverage of the 3D TSV  Market by   in terms of key trends, market size, forecast and CAGR growth over the period of 2018 to 2024. In addition, the study covers deep dive into key product and applications trends in the regional markets of 3D TSV  such as North America, Europe, Asia-Pacific and Latin America over the short run and long run.

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3D Through-Silicon Via (TSV) is a High Performance Interconnect Technique that Passes Through a Silicon Wafer by a Vertical Electrical Connection

3D through-silicon via (TSV) is a high performance interconnect technique that passes through a silicon wafer by a vertical electrical connection. TSV technique is an alternative to wire-bond and flip chips owing to the length of the connections in TSVs are shorter than the traditional technique. 

Further, advantages of TSVs are lower power consumption, better electrical performance, higher density with wider data width and bandwidth. Through-silicon via (TSV) interconnects have applications in 2.5D TSV and 3D TSV packaging that require very high performance and functionality at the lowest energy. Through-silicon via used in image sensors such as CMOS image sensors and 3D integrated circuits. In 3D integrated circuits, TSV provides shortest chip-to-chip interconnection, smallest pad size, and pitch of interconnects.

Rising demand for miniaturization of electronic device owing to its improved compact size chip architecture drives the growth of 3D TSV market. Further high performance, high density, and power utilization of 3D TSV help in the process of miniaturization of electronic device that fuels the growth 3D TSV market. Moreover, an increase in the adoption of cloud-based storage for packaging applications fuels the growth of 3D TSV market. In cloud-based storage applications, 3D TSV majorly used owing to its ability to transmit high-speed data with lower power consumption. 

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Development in the Smart Lighting Sectors that are Designed for Energy Efficiency Coupled with the Growth of 3D TSV Industry

Furthermore, use of 3D TSV in Dynamic random-access memory (DRAM) that stores each bit of data in a separate tiny capacitor within an integrated circuit propels the growth of 3D TSV market. Development in the smart lighting sectors that are designed for energy efficiency coupled with the growth of 3D TSV market. However, a possibility of fragility while handling the ultra-thin components and thermal issues regarding components hinders the growth of 3D TSV market. On the other hand, thermal issues caused due to a high level of incorporation is a challenging factor for the growth of the 3D TSV market. Technological advancement and applications related to MEMS, memory, imaging, and optoelectronics are expected to provide beneficial opportunities for 3D TSV market.

Among the geographies, Asia Pacific dominated the 3D TSV market. In this region, demand for a 3D integrated circuit using TSV technology has resulted in the adoption of 3D TSV technology. Increasing demand for new memory technology and huge presence of market players in Asia Pacific region fuels the growth of 3D TSV market. 

Intensifying research and development activities regarding the design of 3D integrated circuits in North America and Europe region boosts the growth of 3D TSV market in the region. The growth in the European region is owing to the high and improved electronics products having the small form factor and reduced power consumption along with low cost. Advancement in the semiconductor industries has led the Latin America and African regions to grow at a favorable pace.

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Reasons to Buy this Report: 

  • Comprehensive analysis of global as well as regional markets of the 3D TSV .
  • Complete coverage of all the product type and applications segments to analyze the trends, developments, and forecast of market size up to 2024. 
  • Comprehensive analysis of the companies operating in this market. The company profile includes analysis of product portfolio, revenue, SWOT analysis and the latest developments of the company.   
  • Infinium Global Research- Growth Matrix presents an analysis of the product segments and geographies that market players should focus to invest, consolidate, expand and/or diversify.