Future of Global 3D IC and 2.5D IC Packaging Market Along with Key Drivers, Major Manufactures, Business Insights, Trends and Forecast 2024

The latest report on 3D IC and 2.5D IC Packaging Market by Infinium Global Research gives complete coverage of the 3D IC and 2.5D IC Packaging Market by  in terms of key trends, market size, forecast and CAGR growth over the period of 2018 to 2024. In addition, the study covers deep dive into key product and applications trends in the regional markets of 3D IC and 2.5D IC Packaging such as North America, Europe, Asia-Pacific and Latin America over the short run and long run.

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Growing Demand for Smartphones, Tablets, and Gaming Devices Drives the Growth Of 3D IC and 2.5D IC Packaging Industry

The three-dimensional integrated circuit (3D IC) is an integrated circuit that is manufactured by assembling multiple layers of silicon wafers or dies while 2.5-dimensional integrated circuit (2.5D IC) is a packaging technology with active electronic components. 3D IC and 2.5D IC packaging used to improve performance and the reduction of timing delays. Using vertical interconnections and through-silicon vias (TSVs), they act as a singles device. Increased bandwidth, power efficiency, and lower latency are the advantages of 3D IC and 2.5D IC packaging technology. Applications of 3D IC and 2.5D IC packaging are in artificial intelligence, high-performance computing, data Centers, and high-performance network applications.

Growing demand for smartphones, tablets, and gaming devices drives the growth of 3D IC and 2.5D IC packaging market. High usage of data centers as well as cloud computing results in rising demand for high-end computing, servers, and data centers. Furthermore, miniaturization of electronic devices is advancing rapidly owing to the comparative ease in miniaturizing electrons that boosts the growth of 3D IC and 2.5D IC packaging market. 

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Higher Availability of Logic Based Packaging Drives the Growth of 3D IC And 2.5D IC Packaging Industry

Moreover, higher availability of logic based packaging drives the growth of 3D IC and 2.5D IC packaging market. However, the high cost of 3D IC & 2.5D IC packages hinders the growth of 3D IC and 2.5D IC packaging market. In addition, thermal issues related to a higher level of integration hampers the growth of 3D IC and 2.5D IC packaging market. Technological developments in 3D IC & 2.5D IC packaging are expected to provide beneficial opportunities for the 3D IC and 2.5D IC packaging market.

Among the geographies, Asia-pacific dominates the 3D IC and 2.5D IC packaging market owing to various applications in consumer electronics. The presence of manufactures and suppliers along with the integration of 3D IC and 2.5D IC packaging technology in the Asia Pacific region is growing rapidly that boosts the growth of 3D IC and 2.5D IC packaging market .The rapid adoption and evolving use of smartphones along with tablets and e-readers in the U.S. fuels the growth of 3D IC and 2.5D IC packaging market.

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Reasons to Buy this Report: 

  • Comprehensive analysis of global as well as regional markets of the 3D IC and 2.5D IC Packaging.
  • Complete coverage of all the product type and applications segments to analyze the trends, developments, and forecast of market size up to 2024. 
  • Comprehensive analysis of the companies operating in this market. The company profile includes analysis of product portfolio, revenue, SWOT analysis and the latest developments of the company.   
  • Infinium Global Research- Growth Matrix presents an analysis of the product segments and geographies that market players should focus to invest, consolidate, expand and/or diversify.