Select Page

Market Highlights

Global Electronic Packaging Market is expected to register a CAGR of 16.10% during the forecast period of 2019–2025. There are various factors contributing to the growth of the global electronic packaging market such as rising concerns associated with the consumer and product safety and increasing investment made by the private and government companies for enhancing the product quality.

Get Free Sample of Report @ https://www.marketresearchfuture.com/sample_request/8705

Key Players

MRFR recognizes the Key Players in the Global Electronic Packaging as AMETEK Inc. (US), Dordan Manufacturing Company (US), DuPont de Nemours, Inc. (the US), GY Packaging, (US), Plastiform Inc. (US), Kiva Container Corporation (US), Primex Design & Fabrication (US), Quality Foam Packaging Inc. (US), Sealed Air Corporation (US), The Box Co-Op (US), UFP Technologies, Inc. (US), Intel Corporation (US), STMicroelectronics NV (Switzerland), Xilinx Inc. (US), Samsung Electronics Corporation Ltd (South Korean), AMS AG (Austria), Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan),  among others.

The prominent players keep innovating and investing in research and development to offer a cost-effective product portfolio. There have been recent mergers and acquisitions among the key players, a strategy of business entities for strengthening their reach to the customers.

Key Segments

The Global Electronic Packaging Market has been segmented based on Material, Packaging Technology, End-Users, and Region.

By Material, the market has been segmented into plastic, metal, glass, and others.

By Packaging Technology, the market has been segmented into the through-hole mounting, surface surface-mount technology (SMD), and chip-scale packages (CSP)

By End User, the market has been segmented into consumer electronics, aerospace & defense, automotive, telecommunication, others.

By Region, the market has been segmented into North America, Europe, Asia-Pacific, and the rest of the world.

Browse Full Report Details @ https://www.marketresearchfuture.com/reports/electronic-packaging-market-8705

Regional Analysis

The Global Electronic Packaging Market is estimated to grow at a significant rate in the future. The geographical analysis of the electronic packaging market has been conducted for North America, Europe, Asia-Pacific, and the rest of the world.

North America accounted for the second-largest market share in 2018 due to the presence of various electronic packaging companies present in the region, which are developing new and advance techniques for electronics packaging to protect the device and increases their lifespan. The companies such as AMETEK Inc., Kiva Container Corporation, and Xilinx Inc. are some of the companies present in the region which offer various packaging solutions to the electronics manufacturing companies. Additionally, the early adoption of technology is considered as one of the major factors driving the market in the region. Moreover, the early adoption of 3D packaging in the region is also contributing to the growth of the market. Further, based on countries, North America has been segmented as the US, Canada, and Mexico.

Europe accounts for the third-largest market share in the electronic packaging market and is expected to grow with a significant  CAGR during the forecast due to the presence of companies such as Siemens AG, Bosch, and ABB Limited. These companies offer various solutions across industries, including energy & power, automotive, and aerospace and defense, to enhance their operations and increase productivity with the help of automation. Germany accounts for the largest market share in the region due to the presence of consumer electronics, automotive, electronics, and pharmaceutical industries. Moreover, the demand for various smart devices is increasing, which is driving market growth.

Asia-Pacific is expected to be the dominating regional market during the forecast period; rising urbanization, technological advancements, and increasing demand for advanced electronic devices are some of the major factors which are driving the electronic packagings market in the region. Additionally, the growing number of electronic device manufacturing facilities in the region is also fueling the growth of the market. China accounts for the largest market share in the region for the electronic packaging market due to increasing investments by the private and government sectors for the development of new packaging technologies.

The rest of the world is expected to register a significant CAGR during the forecast period due to increasing investments made by the government and companies for the development of advanced technology in the region. Further, the region has been segmented into South America and the Middle East & Africa.

About Market Research Future:

At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.

Contact:

Market Research Future

+1 646 845 9312

Email: sales@marketresearchfuture.com