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Wafer-level Packaging Equipment Market report 2019-2024 begins from overview of Industry Chain structure, and describes industry environment, then analyses market size and forecast of Wafer-level Packaging Equipment by product, region and application, in addition, this report introduces market competition situation among the vendors and company profile, besides, market price analysis and value chain features are covered in this report.

About Wafer-level Packaging Equipment
In the recent years, wafer-level packaging equipment production value showed a trend of steady growth. At present, the major manufacturers of wafer-level packaging equipment are concentrated in North America, EU, and Japan. Applied Materials is the world’s largest wafer-level packaging equipment producer.

Wafer-level packaging equipment is very expensive, usually it does not go through the distributor and provided by the manufacturer directly to the customer.

Covered in this report

According to this study, over the next five years the Wafer-level Packaging Equipment market will register a 8.9% CAGR in terms of revenue, the global market size will reach US$ 3090 million by 2024, from US$ 2010 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Wafer-level Packaging Equipment business, shared in Chapter 3.

This report presents a comprehensive overview, market shares, and growth opportunities of Wafer-level Packaging Equipment market by product type, application, key manufacturers and key regions and countries.

This study considers the Wafer-level Packaging Equipment value and volume generated from the sales of the following segments:

Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
Fan In
Fan Ou

Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
Integrated Circuit Fabrication Process
Semiconductor Industry
Microelectromechanical Systems (MEMS)

The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
Applied Materials
Tokyo Electron
KLA-Tencor Corporation
EV Group
Tokyo Seimitsu
Suss Microtec
Rudolph Technologies

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Key Topics Covered:
1 Scope of the Report
2 Executive Summary
3 Global Wafer-level Packaging Equipment by Players
4 Wafer-level Packaging Equipment by Regions
5 Americas
7 Europe
8 Middle East & Africa
9 Market Drivers, Challenges and Trends
10 Marketing, Distributors and Customer
11 Global Wafer-level Packaging Equipment Market Forecast
12 Key Players Analysis
13 Research Findings and Conclusion

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