Globally, the multi-chip module market is expected to have moderate growth over the forecast period. This is due to the strong need for small-sized chip modules that improves device operation while managing mass and size of the chip. A multi-chip module shortens the signal route between multiple ICs and uses a high-performance substrate material. However, lack of technical expertise and continuous innovation in the chip manufacturing processes, resulting into development of alternate products act as major restraining factors for the growth of the multi-chip module market.
In this study, the Multi-Chip Module Market is segmented based on type, industry vertical, and regions/country. By type, the market is segmented into NAND-based MCP, NOR-based MCP, eMCP, and uMCP. By industry vertical, the market is segmented into consumer electronics, automotive, medical devices, aerospace and defense, and others. Finally, the regions covered in this study are North America, Europe, Asia-Pacific, and the rest of the world. North America is further segmented into the US, Canada, and Mexico; Europe into Germany, France, the UK, and the rest of Europe; and Asia-Pacific into China, India, Japan, and the rest of Asia-Pacific.
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The prominent players in multi-chip module market are SK HYNIX INC. (South Korea), Palomar Technologies (US), Infineon Technologies (US), Samsung Electronics (South Korea), STMicroelectronics (Switzerland), Micross (US), Cypress Semiconductor (US), Macronix International Co., Ltd. (Taiwan), TEKTRONIX, INC. (US), and Texas Instruments (US).
The global market for global multi-chip module is estimated to grow at a moderate rate during the forecast period from 2018 to 2023. The geographical analysis of the market is studied for North America, Europe, Asia-Pacific, and the rest of the world.
Asia-Pacific is presumed to have moderate growth in the multi-chip module market. China, India and Japan are the leading countries in the region. The growth is attributed to increase in demand for the multi-chip module units in the consumer electronics industry vertical. North America is anticipated to be the fastest growing region in the multi-chip module market over the forecast period. The US and Canada are the leading countries in the multi-chip module market in the region. Presence of many leading semiconductor and electronic product manufacturers drives the growth of the multi-chip module market in the region.
The global multi-chip module market is segmented into type, industry vertical, and regions/country.
By type, the market is segmented into NAND-based MCP, NOR-based MCP, eMCP, and uMCP.
By industry vertical, the market is segmented into consumer electronics, automotive, medical devices, aerospace and defense, and others.
By region, the market is segmented into North America, Europe, Asia-Pacific and the rest of the world.
The global multi-chip module market consists of various listed as well as privately held semiconductor and electronics manufacturers. These companies mostly follow both organic and inorganic growth approaches through product upgrades, partnerships, and collaborations to offer cost-efficient and very small-sized multi-chip modules. The prominent players are mainly focused on developing competitive products to penetrate into various end-verticals. Additionally, improvements of the global economic scenario combined with advances in technology have rendered the market competitive. The competitive environment in the market is likely to intensify further due to the increasing service extensions, technology innovation, and strategies such as mergers and acquisitions.
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- Multi-chip module vendors
- Electronic product manufacturers
- Standard making bodies
- End Verticals
- Distributors and Value-added Resellers (VARs)
- Research Organizations
- Semiconductor manufacturers
- System Integrators
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