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Acquire Market Research has announced a new report titled “Global WBG Power Devices Market Growth 2019-2024” to their offerings

According to this study, over the next five years the WBG Power Devices Market will register a 33.4% CAGR in terms of revenue, the global market size will reach US$ 1820 million by 2024, from US$ 320 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in WBG Power Devices business.

Wide-bandgap semiconductors (WBG or WBGS) are semiconductor materials which have a relatively large band gap compared to typical semiconductors.

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Currently, there are many producing companies in the world. The main market players are Infineon, Rohm, Mitsubishi, STMicro, Fuji, Toshiba, Microsemi, United Silicon Carbide Inc. , GeneSic , Efficient Power Conversion (EPC), GaN Systems and so on. The production value of WBG Power Devices is about 253.6 Million USD in 2016.

Infineon is the largest production Cmpany for WBG Power Devices, with a production value market share nearly 49.01% in 2016.

Briefly speaking, in the next few years, WBG Power Devices industry will be a rapid development industry. Sales of WBG Power Devices have brought a lot of opportunities, there will more companies enter into this industry, especially in developing countries.

This report presents a comprehensive overview, market shares, and growth opportunities of WBG Power Devices market by product type, application, key manufacturers and key regions and countries.

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This study considers the WBG Power Devices value and volume generated from the sales of the following segments:

Segmentation by product type:

GaN

SiC

Segmentation by application:

Automotive & Transportation

Industrial Use

Others

This report also splits the market by region:

Americas (United States, Canada, Mexico, Brazil)

APAC( China, Japan, Korea, Southeast Asia, India, Australia)

Europe( Germany, France, UK, Italy, Russia, Spain)

Middle East & Africa( Egypt, South Africa, Israel, Turkey, GCC Countries)

The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market.

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The key manufacturers covered in this report:

Infineon, Rohm, Mitsubishi, STMicro, Fuji, Toshiba, Microsemi, United Silicon Carbide Inc., GeneSic, Efficient Power Conversion (EPC), GaN Systems.

In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.

Research objectives

To study and analyze the global WBG Power Devices consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.

To understand the structure of WBG Power Devices market by identifying its various subsegments.

Focuses on the key global WBG Power Devices manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.

To analyze the WBG Power Devices with respect to individual growth trends, future prospects, and their contribution to the total market.

To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).

To project the consumption of WBG Power Devices submarkets, with respect to key regions (along with their respective key countries).

To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

To strategically profile the key players and comprehensively analyze their growth strategies.