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Axiom MRC added an, “Encapsulation Resins Market Report, By Resins Type (Epoxy Resins, Polyurethane Resins and Silicone Resins), End User Industry (Electronics & Electrical, Automotive, Telecommunication and Industrial) and Geography – Global Market Share, Trend Analysis & Forecast Up To 2025”
Encapsulation resins are the components used to protect and insulate printed circuit boards and electronic components and protect it from moisture, thermal and physical shocks and dust. It also offers offer excellent mechanical protection.

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It is essential that the inclusion of air during mixing and potting of encapsulation resins is kept to an absolute minimum. The major types of encapsulation resins include epoxy, polyurethane and silicone resin. Polyurethanes are flexibility, variable shore hardness and short pot life.

Encapsulation Resins Market Outlook
The global market is estimated and forecasted in terms of revenue (USD million) generated by the encapsulation resins market. Encapsulation resins market is primarily driven by rising demand from end user application like military, industrial, domestic and automotive industry and increasing number of potential requirements within the LED electronic products.

Encapsulation Resins Market Segmental Overview
Encapsulation Resins Market by Resins Type
Into Epoxy Resins
Polyurethane Resins
Silicone Resins and Others.

Encapsulation Resins Market by End Users Industry
Electronics & Electrical
Telecommunication And

Encapsulation Resins Market by Geography
North America
Asia Pacific and
Rest of the world.

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Encapsulation Resins Market Key Players
Some of the key participants of the global encapsulation resins market are ACC Silicones Ltd, BASF SE, The Dow Chemical Company, Henkel AG & Co. KGaA, Hitachi Chemical Co., Ltd, Huntsman International LLC, H.B. Fuller Company, Master Bond Inc, Fuji Chemical Industries Co., Ltd, Shin-Etsu Chemical Co. Ltd, etc.

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