Globally, the FinFET technology market is expected to grow from USD 5.2 billion in 2017 to USD 34.33 billion by 2023, at a CAGR of 37.8% during the forecast period. FinFET or fin field effect transistor. It is a 3D transistor that is utilized in modern processors to improve the circuit efficiency. FinFET technology brings down voltages and increases the working rate of the processor and the integrated circuit unlike non-FinFET chipsets. These benefits allow the FinFET technology to be used in various electronic devices such as smartphones, television, and other consumer electronic devices.
Thus, the rising demand of the consumer electronics is anticipated to drive the market growth. The increasing demand for FinFETs in the semiconductor industry is expected to fuel the market growth during the forecast period. Similarly, the increasing demand for high-performance chips for reducing the current leakage during functioning is also driving the market. Moreover, increasing utilization of wearable products is also contributing to the market growth. As the devices are becoming compact, the integrated circuits are also getting complex. Therefore, to maintain the working efficiency of the device, FinFET is used to enhance the ability of the system by reducing the current leakage. However, the design complexity in FinFET chips is expected to limit their adoption.
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Major Key Players
- Taiwan Semiconductor Manufacturing Company Limited (Taiwan),
- GlobalFoundries Inc. (US),
- Samsung Electronics Corporation Ltd (South Korea),
- United Microelectronics Corporation (Taiwan),
- Intel Corporation (US),
- Qualcomm Technologies Inc (US),
- Arm Holdings PLC (UK),
- MediaTek Inc. (Taiwan),
- Xilinx Inc (US),
- Semiconductor Manufacturing International Corporation (China)
Globally, the FinFET Technology Market is expected to grow from USD 5.2 billion in 2017 to USD 34.33 billion by 2023, at a CAGR of 37.8% during the forecast period.
The market for FinFET technology is considered to grow at a rapid rate. In October 2018, Synopsys, Inc. and Taiwan Semiconductor Manufacturing Company Limited (TSMC) collaborated to develop portfolio of design ware IP for N7and FinFET process. In March 2016, Arm Limited and Taiwan Semiconductor Manufacturing Company Limited announced a multi-year agreement to collaborate to develope 7nm technology FinFET process technology for high-performance computing. The collaboration includes the technological advancement in FinFET technology which includes a design solution for future low-power, high-performance compute SoCs.
The global market for FinFET technology is estimated to grow at a high rate during the forecast period from 2018 to 2023. The geographical analysis of FinFET technology is studied for North America, Europe, Asia-Pacific, and the rest of the world.
North America is the dominating region due to early adoption of FinFET technology. Additionally, the presence of various key vendors in the region such as Xilinx, Inc, Qualcomm Technologies Inc, Intel Corporation, GlobalFoundries Inc, and others and research and development centers in the region also drives the market as various developments are taking place to increase the working capacity of semiconductors. Moreover, the development of new consumer electronic devices is increasing which is fueling the growth of the market. Asia-Pacific is the fastest growing region as the demand for consumer electronics such as smartphones, computers, laptops, and others is increasing in the region. The automotive industry is expected to contribute to the market as FinFET technology is used as the emerging automotive applications for vehicle safety and automated driving that requires a combination of processing power and extreme reliability that FinFET provides. Thus, Asia-Pacific market is expected to dominate the FinFET market in the coming years.
The global FinFET technology market has been segmented based on technology, product, end-user and region
By technology, the market is segmented into 7nm, 10nm, 14nm, 16nm, 20nm, and 22nm.
By product, the market is segmented into CPU (Central Processing Unit), SoC (System-on-Chip), FPGA (Field-Programmable Gate Array), GPU (Graphics Processing Unit), MCU (Micro Controller Unit), and Network Processor.
By end-user, the market is segmented into consumers electronics, automotive, high-end networks and others.
By region, the market is segmented into North America, Europe, Asia-Pacific, and the rest of the world.
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- Electronic Design Automation (EDA)
- Design Tool Vendors
- IT & Telecommunication Industry
- Original Equipment Manufacturers (OEMs)
- Integrated Device Manufacturers (IDMs)
- Original Design Manufacturers (ODMs)
- Automotive ODM
- OEM Technology Solution Providers
- Research Institutes and Organizations
- Technology Investors
- Governments and Other Regulatory Bodies
- Suppliers and Distributors
- Technology, Service, And Solution Providers
TABLE OF CONTENTS
- Executive Summary
- Scope of the Report
2.1. Market Definition
2.2. Scope of the Study
2.2.1. Research Objectives
2.2.2. Assumptions & Limitations
2.3. Markets Structure
- Market Research Methodology
3.1. Research Process
3.2. Secondary Research
3.3. Primary Research
3.4. Forecast Model
- Market Landscape
LIST OF TABLES
Table 1 Global FinFET Technology Market, By Country, 2018-2023
Table 2 North America: FinFET Technology Market, By Country, 2018–2023
Table 3 Europe: FinFET Technology Market, By Country, 2018–2023
Table 4 Asia-Pacific: FinFET Technology Market, By Country, 2018–2023
Table 5 Latin America: FinFET Technology Market, By Country, 2018–2023
Table 6 North America: FinFET Technology Market, By Country
Table 7 North America: FinFET Technology Market, By Technology
Table 8 North America: FinFET Technology Market, By Product
Table 9 North America: FinFET Technology Market, By End-User