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Axiom Market Research & Consulting added a, “Encapsulation Resins Market Report, By Resins Type, End User Industry and Geography – Global Market Share, Trend Analysis & Forecast Up To 2025” Encapsulation resins are the components used to protect and insulate printed circuit boards and electronic components and protect it from moisture, thermal and physical shocks and dust. It also offers offer excellent mechanical protection. It is essential that the inclusion of air during mixing and potting of encapsulation resins is kept to an absolute minimum.

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Encapsulation Resins tMarket Analysis:
Encapsulation resins market is primarily driven by rising demand from end user application like military, industrial, domestic and automotive industry and increasing number of potential requirements within the LED electronic products.
However, unfavourable factors hindering the growth of encapsulation resins market includes material inconsistency, fluctuation in the prices of raw materials and rising demand for bio-based products.

Encapsulation Resins Market Segmentation Based On:

By Resin Type:

1. Epoxy Resins
2. Polyurethane Resins
3. Silicone Resins

By Application:

1. Electronics & Electrical
2. Automotive
3. Telecommunication
4. Industrial

By Geography:

1. North America
2. Europe
3. Asia Pacific
4. Rest of the world

Brows Full Report Details:

Leading Partners of Encapsulation Resins Market:
ACC Silicones Ltd, BASF SE, The Dow Chemical Company, Henkel AG & Co. KGaA, Hitachi Chemical Co., Ltd, Huntsman International LLC, H.B. Fuller Company, Master Bond Inc, Fuji Chemical Industries Co., Ltd, Shin-Etsu Chemical Co. Ltd and among others.

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Axiom Market Research & Consulting™ (also known as Axiom MRC), is a full-service market research and data analytics firm, driven by a simple aim of providing key market intelligence to companies to assist them in taking informed business decisions pertaining to their marketing strategy, investments, new product launches, market competition, consumer or end users, social media trends etc.

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